MediaTek launches Dimensity 8300 chipset

MediaTek has launched its new generation chipset in the market. The company has launched Dimensity 8300 chipset. This is a power efficient chip which has been designed keeping 5G phones in mind. In this, users will get the benefit of generative AI, adaptive gaming and fast connectivity. This new chipset from MediaTek will be used in 5G phones which will be launched globally by the end of 2023. This means that you will start getting this new chipset in smartphones from the end of this year.

This chipset is made with TSMC’s second generation 4nm process. It has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores, based on Arm’s latest V9 CPU architecture. The company says that the new edition of the Dimensity 8000 SoC series has 20% faster CPU performance and 30% higher power efficiency compared to the previous generation chipset. It also has Mali-G615 MC6 GPU which delivers 60% more performance and 55% better power efficiency.

3 times better AI performance

The Dimensity 8300 chipset supports full Generator AI with the APU 780 AI processor. These SoCs support developers in building applications that use large language models (LLMs) up to 10B as well as static expansion. The APU 780 features the same architecture as the flagship Dimensity 9300 SoC, offering a 3.3x increase in AI performance compared to the Dimensity 8200. This means you get 3 times better AI performance.

Fast internet and good gaming performance

The chipset also features MediaTek’s 14-bit HDR-ISP Imagick 980 for photos and videos (4K60 HDR). The Dimensity 8300 features HyperEngine adaptive game technology for advanced power savings and a 3GPP Release-16 standard 5G modem for faster Internet speeds.

Other key features of the MediaTek Dimensity 8300

• LP5x 8533Mbps and uFS4.0 MCQ memory provides a 33% speed boost on LPDDR and up to 100% faster R/W to flash compared to Dimensity 8300’s predecessor.
• MediaTek 5G UltraSave 3.0+ improves 5G power efficiency up to 20% in daily usage scenarios compared to the previous generation.
• Upgraded Wi-Fi 6E performance with 160 MHz bandwidth, plus Wi-Fi/Bluetooth hybrid coexistence technology so earbuds, wireless gamepads, and other peripherals work together seamlessly.
• Dimensity 5G Open Resource Architecture (DORA), allowing device makers to create unmatched smartphones that stand out in unique ways amongst competitors.